01/hardware/light/Manufacturing Report/Manufacturing - 01 Light Report.md

01 Light Manufacturing Report

Table of Contents

• Introduction
• Product Requirements
• Firmware Design
• Electrical Design
• User Experience + Industrial Design
• Appendix

Introduction

This report captures the comprehensive work completed through June 2024, including detailed product requirements, product architecture, design thinking, and strategic decisions. Below, you'll find links to essential assets, resources, and documentation that collectively support the development and vision of the O1 Light.

Thanks to Facture for the amazing work producing these resources.

Product Requirements

Project Details

The Product Requirements Document (PRD) is the north star during development and includes additional information such as success metrics and risks/mitigations. It is critical that this is drafted early on in any project and maintained diligently throughout. Requirements are categorized and utilize priority ranking (P0/P1/P2) to focus on core function, but not forgetting about reach goals or long-term product targets.

The following summarize the content that is present in the PRD:

Product Requirements

#	Feature	Requirement	Priority	Notes
1	System Requirements	Full device COGs should be <$70, <$45, <$30	P0, P1, P2	Updated per kickoff
2	Functional Requirements - UX/ID	General size must be around the size of a Glossier You	P1
		Thumbprint indentation on top of the case	P0
		Silicon wrapper/skin around the main mechanical enclosure	P1	To be determined upon manufacturing vendor clarifying information
		Silicone wrapper surface should be pleasant to hold	P1	STEM Player as inspiration
		Thumbprint size and orientation must cater to appropriate device orientation	P0
		Device case must fit comfortably within the vast majority of consumers' hands	P0
		Users must be able to easily access and plug in a USB C cord to charge	P0
		Tactile button to engage voice transmission	P0
		Haptic vibration must be detectable to user while in hand and pocket	P1
		LED must be perceivable to user in daylight	P2	May or may not be included in the device
3	Functional Requirements - Mechanical	No larger than <55 x 55 x 38> mm	P0	No larger than current prototype
		No heavier than <50> g	P2	Baseline of an AirPods case - open for discussion
		All component parts shall be located and secured to avoid chatter	P0
		Pad printing shall meet the requirements of Abrasion and Adhesion	P1	Should this be branded?
		Date of manufacture marking on the exterior of the housing	P1	Indelible and uniquely identified
		PROTOTYPE – not for resale	P1
4	Functional Requirements - Electrical	Device shall be capable of communicating with server via Bluetooth	P0
		Device shall be capable of communicating with server via Wifi	P1
		Audio output should be clear and discernible from an arm’s length away	P0
		Device shall be audible from 12-18" away in quiet environment	P1	User is expected to need to bring device closer in noisy environments
		Speaker driver shall be capable of delivering at least xx Watts of power	P0	01 Light has 2.5W speaker driver but no listed speaker
		Speaker driver must have no more than xx % THD	P0
		Shall be capable of producing an acoustic sound pressure level (SPL) of at least xx dB at 10 cm	P0
		Microphone shall have SNR of at least 61.5 dB(A)	P0	Driven from 01 Light components
		Microphone shall have sensitivity of at least -19 dBFS (94dB SPL @ 1 kHz)	P0	Driven from 01 Light components
		Tactile pushbutton shall have an operating force of at least xx gf	P1
		Battery should provide at least 4 hours of active Bluetooth use	P0
		Battery should provide at least 2 hours of active WiFi use	P0
		Device should provide haptic feedback to user	P1
		User must be able to charge battery via USB-C port	P0
		Installing FW updates should be possible via USB-C port	P1
		Device may contain LED to indicate status of charge	n/a	Client expects one more discussion (with Killian included) about this
		Device may leverage Bluetooth headset for speaker and microphone	P2
5	Functional Requirements - Firmware	Device shall disable WiFi when Bluetooth is used	P2	ESP supports simultaneous connections, however, device should have capabilities of turning the unused or lower speed connection off to conserve power.
		Microphone shall never be enabled unless pushbutton is pressed	P0
		Device shall deliver unique tones and/or vibration to alert user of low power and fully charged states	P1	Specific UX alert requirements TBD
		User should be able to turn the device ON/OFF by quickly pressing the pushbutton 3 times	P1	quickly needs more definition
		Device should be capable of simultaneous charging and operation	P1
		Security of data transfer shall be considered only after all P0 items are complete	P1
6	Functional Requirements - Software		n/a
7	Environmental Requirements	Ambient temperatures of <-15°C, 45°C>	P0
		Ambient temperatures of <-30°C, 50°C>	P0
		Ambient relative humidity of <10%, 90%>	P0
		Ambient relative humidity of <10%, 90%>	P0
		0 to 10,000 feet steady-state	P0
		Airplane transit – Pressure change of 0 ft to 8,000 ft (2 hr dwell) to 0 ft with a ramp rate of 250 ft/min	P0	Device must remain in off state
		IP53	P0	Minimal use case - going out in the rain
		IP65	P1	Expected use case
		Drop from 30” – no permanent damage to the device	P0	Some cosmetic damage is acceptable
		Drop from 60” – no permanent damage to the device	P1	Some cosmetic damage is acceptable
		Visual color change no greater than Slight after exposure using UVA-351 lamps for 200 hours	P1	Corresponding to 8 on the ASTM scale of 0 (Very Severe) to 10 (No Effect) after exposure using UVA-351 lamps for 200 hours (Test per ASTM D4674-02A, Method IV)
		Device shall withstand wiping with mild soap or detergent and water	P0	No functional or cosmetic damage
		No substantial staining or cosmetic defect from household cleaners	P1
		USB connector	P1
		The device shall not contain materials which sustain fungus growth	P1
8	Safety and Regulatory	The surface temperature of the product does not exceed <75 degC> during any use case (e.g. charging & being used)	P0	Derived off of a plastic enclosure and available standards
9	Other	The packaging will protect the device and all other items from drop of <5ft>	P0	All packaging requirements to be discussed in next meeting to determine who is owning this.
		The final packaging will include instructions for use	P0
		The final product will include a 01 Light, Charger, Power Brick	P0
		The device should be presented or revealed in a visually appealing way upon initial unboxing	P1

Electrical Design

Electrical Design Approach

Electrical hardware design follows on requirements definition with the creation of a system block diagram and selection of key components for each block. Key components were selected based on ability to meet requirements, as well as other key criteria such as component size, availability, and minimizing development risk. This major component selection is to be followed by schematic capture, PCB layout, PCBA manufacture, and test.

To support a tight development timeline and requirements for wireless communication, a MCU module providing required radio functions with a transferable FCC certification was targeted. Selecting a module that provided desired support for both Bluetooth/BLE and Wi-Fi with the required certification for handheld (“portable”) devices proved to be challenging, leading to a strategy of extending the existing certification for a non-handheld device through a change in ID. In order to minimize cost and overhead of this approach, portable certification was to be obtained by limiting RF transmit power in firmware to a level that provided exemption from SAR testing.

Hardware Block Diagram

Component Selection - Overview

Due to proposed speed of development, component selection had to be completed quickly and without any significant error. The following priorities were considered while selecting electrical components:

1. Minimizing risk to schedule
   • Classified design elements into high and low risk categories based on the following:
     • Priority of the feature it supports (P0, P1, P2)
     • Confidence in ability to select the right component the first time, without testing
     • Impact to system if component needs to be re-spec'd
   • Overspec’d components to ensure performance requirements would be easily achieved
2. Speed of selection and development
   • Did not always exhaust every available option if subsystem was low enough risk and suitable options were already found
   • Considered hardware and firmware development implications when appropriate, opted for well supported ICs with existing driver libraries
3. Size of component and associated design
   • Carefully reviewed size of each component and proposed solutions to make sure design would meet space constraints

Wireless Module Selection

Selection: ESP32-PICO-MINI-02

Key Criteria: Wi-Fi & BLE/BT Classic Support, I2S Interface

Justification:

• Supports BT Classic which is needed to stream audio with iPhones
• Previously used chipset with well documented libraries available

MFR	PRODUCT #	IC	LxWxH (mm)	Est. Cost	Ipeak Tx/Rx (mA)	CFR 2.1093	BT VERSION	BT CLASSIC	WIFI	AUDIO	NATIVE USB?	Notes
Infineon	CYBT-413061-02	CYW20719	12 x 16.3 x 1.7	$14.70		Yes	5	Yes	No	I2S	?
Ezurio	BT860-SA	CYW20704	12.9 x 8.5 x 2.2	$9.86		Yes	5	Yes	No	I2S	No	Certification info not totally clear from publicly available info
Infineon	CYBT-343026-01	CYW20706	15 x 15.5 x 1.95	$8.63		Yes	4.2	Yes	No	I2S
Microchip	BM64SPKS1MC2-0001A	IS2062	15 x 29 x 2.5	$12.71		Yes	5	Yes	No	I2S	No	Size larger than desired, integrates battery charger
Ezurio	453-00052R	nRF5340	10 x 15 x 2.2	$10.91	9.1/8.6	Yes	5.2	No	No	I2S	?
Silicon	BGM113A256V21R	EFR32BG	9.15 x 15.7 x 1.9	$11.51		Yes	4.2	No	No	I2S	No
Ezurio	453-00005	nRF52810	10 x 14 x 2.2	$6.41	15.4/10	Yes	5	No	No	PDM	?	PDM input only
ESP	ESP32-S3-MINI-1	ESP32-S3	15.4 × 20.5 × 2.4		355/97	No	5	No	Yes	I2S	Yes
ESP	ESP32-C3-MINI-1	ESP32-C3	13.2 x 16.6 x 2.4		350/82	No	5	No	Yes	I2S	Yes
ESP	ESP32-PICO-MINI-02	ESP32-PICO	** 13.2 × 16.6 × 2.4**	$3.50	368/117	No	4.2	Yes	Yes	I2S	No

Regulatory Approach Summary & Costs

• Exposure:

  • Module survey revealed lack of pre-certified modules supporting BT/BLE and Wi-Fi for “Portable” use cases
    • Several BT/BLE only options identified
    • Lack of Wi-Fi options attributed to typically higher transmit power
  • Strategy: Obtain Change of ID + Class II Permissive Change for Portable Certification
    • SAR Testing: Demonstrates exposure compliance for portable use, but test is costly and time consuming
    • Transmit Power Exemption: Provides a shorter path to certification with performance trade-off
      • Initial calculation indicated that Exemption could be acquired for transmit powers <10dBm
    • See KDB 447498 D01 General RF Exposure Guidance v06 for detailed information

• Emissions:

  • Self Declaration of Conformity
  • Intentional Radiator Testing & Unintentional Radiator Testing

Regulatory Costs

Vendor	Unintentional Radiator Testing	Intentional Radiator Testing	Administrative Fees	SAR Testing	Total (Excluding SAR)	Total (Including SAR)
CKC Laboratories	$1,720	$1,720	$4,350	$7,550**	$7,790	$15,340
Element	$2,962	$6,105	$5,395	$29,752	$14,462	$44,214

**Unverified estimate

Audio Subsystem

• Speaker

  • Considered high risk due to highest priority (P0) designation, size constraints, and significant impact to mechanical design should speaker need to be respec’d
  • Performance improvements from the existing prototype were among the most important for this component
  • Prioritized speaker component survey so that samples may be ordered and tested

• Amplifier

  • Considered low risk due to confidence in ability to spec IC that meets performance requirements
  • I2S interface limited available options

• Microphone

  • Considered low risk due to our ability to identify microphone used in existing prototype which informed specifications
    • Client was satisfied incumbent microphone performance
  • I2S interface limited available options

Speaker Selection

Selection: OWS-142037TA-4

Key Criteria: Efficiency (dB SPL), Size, Rated Power

Justification:

• Fit within size constraints, best available option with respect to efficiency and rated power specs

MFR	PRODUCT #	IMPEDANCE (Ω)	POWER RATED (W)	dB(A) SPL	RES FREQ (Hz)	LxWxH (mm)	MOUNTING	TERMINATION	IP	PRICE (QTY 1)	PRICE (QTY 100)	NOTES
PUI Audio	SMS-1804MS-HT	4	1	96	950	18 x 18 x 5.9	PCB Mount	SMD	67	$4.51	$3.02
CUI Devices	CMS-15118C-SP	8	0.8	88	850	15 x 11 x 3	Board Mount	Spring	-	$1.81	$1.40
CUI Devices	CMS-18138A-SP	8	0.8	92	1k	18 x 13 x 2.5	Board Mount	Spring	-	$2.50	$1.68
CUI Devices	CMS-15118D-L100	8	0.7	91	950?	15 x 11 x 3	Board Mount	Wire Leads	-	$2.83	$1.90
CUI Devices	CDS-1328-16-SP	16	0.2	85	1.1k	13 x 13 x 2.8	Board Mount	Pads	-	$1.76	$1.19
PUI Audio	AS01508MS-WP	8	1	95	950	15 x 11 x 3	PCB Mount	SMD	65	$2.37	$1.60
DB Unlimited	SM160908-1	8	0.5	96	900	16 x 16 x 3.3	Flush Mount	Wire Leads	-	$2.32	$1.55	N/A DigiKey
Toaglas	SPKM.17.8.A	8	0.5	96	900	17 x 17 x 4.4	Frame Mount	Wire Leads	-	$2.38	$2.27
CUI Devices	CDM-16008	8	0.4	93	500	16 x 16 x 3.2	Board Mount	Pads	-	$1.58	$1.20
CUI Devices	CDMG15008-03A	8	0.3	92	900	15 x 15 x 2.8	Board Mount	Pads	-	$1.77	$1.37	OOS DigiKey
CUI Devices	CMS-251405-24SP-X8	4	2	103	950	25 x 14 x 5		Solder Pads	X8	$2.78	$1.87
CUI Devices	CMS-251437-24SP-X8	4	2	103	950	25 x 14 x 5		Solder Pads	X8	$2.97	$2.00
CUI Devices	CMS-231137-158SP-X8	8	1.5	103	1000	23 x 11 x 3.7		Solder Pads	X8	$2.35	$1.58
Challenge	CS18-02P110-03-1X	4	2	104	1100	18 x 16 x 3.7		Solder Pads	67	$3.03	$2.04
Ole Wolff	OWS-142037TA-4	4	2	104.5	1050	20 x 14 x 3.7		Solder Pads	67	$1.34	$0.92
CUI Devices	CMS-1535-058SP	8	0.5	96	1000	15 x 15 x 3.5		Solder Pads	-	$1.82	$1.23

Speaker Driver Selection

Selection: MAX98357AEWL+T

Key Criteria: Output Power, Digital Interface

Justification:

• Well supported libraries available
• More than 3x the output power from prototype component
• Very small footprint needed for complete design

MFR	PRODUCT #	DIMENSIONS (mm)	PRICE (QTY 100)	VOLTAGE (V)	POWER (W)	INTERFACE	NOTES
ADI	MAX98357AEWL+T	1.4 x 1.5 x 0.5	$2.10	2.5 - 5.5	3.2	I2S	Driver libraries available, well supported IC
NXP	TFA9879HN	4 x 4 x 1	$1.80	2.5 - 5.5	2.75	I2S
TI	TAS2110RPPT	4.5 x 4 x 1	$2.36	1.65 - 1.95	6.1	I2S	Integrated boost, designed to be used with battery - may need large caps?
ADI	SSM2537ACBZ-R7	1.2 x 1.2 x 0.3	$2.42	2.5 - 5.5	2.7	I2S

Microphone Selection

Selection: SPH0645LM4H-B

Key Criteria: SNR, Output Protocol

Justification:

• Matched or exceeded (SNR) all specs from incumbent mic used in prototype
• Port location was of mild concern but plan was to design in flexibility to pivot to top facing port if needed

MFR	PRODUCT #	DIMENSIONS (mm)	PRICE (QTY 100)	SNR (dB)	DIRECTION	OUTPUT	VOLTAGE (V)	CURRENT (mA)	PORT LOCATION	NOTES
Knowles	SPM1423HM4H-B	4.72 x 3.76 x 1.4	-	61.5	Omnidirectional	PDM	1.6 - 3.6	0.6	Top	Used in client's prototype, obsolete
DB Unlimited	MM042602-15	4 x 3 x 1.1	$2.10	65	Omnidirectional	PDM	1.6 - 3.6	0.64	Top	No I2S mics w top port, PDM might be viable
Knowles	SPH0645LM4H-B	3.5 x 2.65 x 1.1	$1.49	65	Omnidirectional	I2S	1.62 - 3.6	0.6	Bottom
TDK	ICS-43434	3.5 x 2.65 x 0.98	$1.72	64	Omnidirectional	I2S	1.65 - 3.63	0.55	Bottom
PUI	DMM-4026-B-I2S-R	4 x 3 x 1.1	$1.78	64	Omnidirectional	I2S	1.5 - 3.6	1	Bottom
TDK	ICS-43432	4 x 3 x 1.1	$1.97	65	Omnidirectional	I2S	1.62 - 3.63	1.5	Bottom

UI Subsystem

• Haptic Driver

  • Considered low risk due to priority (P1) designation
  • Needed to consider various motor types (ERM, LRA) and prioritized components supported with existing driver libraries

• Haptic Motor

  • Considered low risk due to priority (P1) designation and abundance of options
  • Decided to select this component after speaker, battery, and PCBA outline were determined so that remaining space could be used to consider suitable candidates

• Pushbutton & LED

  • Considered low risk due to confidence in ability to spec components that meets performance requirements

Haptic Driver and Motor

Selection: DA7280-00V42 (Driver), TBD Motor

Key Criteria: Force (Motor), Rated Output (Driver)

Justification:

• Plenty of output drive (500mA max), supports wide frequency range

ROLE	MFR	PRODUCT #	DIMENSIONS (mm)	PRICE (QTY 100)	TYPE	RPM	FREQ	V_RATED (V)	I_MAX (mA)	FORCE (Grms)	NOTES
MOTOR	PUI Audio	HD-EMC1003-2-LW15-R	10 x 10 x 2.7	$1.55	ERM	13000	-	3	85	?
	Vybronics	VC1018B001L	10 x 10 x 1.8	$1.78	ERM	13500	-	3.2	85	0.4
	Vybronics	VC1020B327F	10 x 10 x 2.1	$2.31	ERM	1350	-	3	85	0.7
	Vybronics	VW0825AB001G	8 x 8 x 2.5	$3.00	ERM	14000	-	3	90	1	BLDC
	Vybronics	VC0720B001F	7 x 7 x 2	$2.37	ERM	10000	-	3	85	0.3
	Vybronics	VCLP0820B004L	8 x 8 x 2.1	$2.31	ERM	9000	-	3	35	0.25
	Vybronics	VC0820B006F	8 x 8 x 2.1	$2.44	ERM	10000	-	3	85	0.3
	Vybronics	VG0640001D	6 x 6 x 4	$3.33	LRA	-	210	1.8	75	0.9
	Vybronics	VG0832014L	8 x 8 x 3.2	$2.35	LRA	-	235	1.8	80	1	AlternateA, AlternateB
	Vybronics	VLV101040A	10 x 10 x 4	$4.35	LRA	-	170	2.5	350	2.75
DRIVER	TI	DRV2605LYZFR	1.47 x 1.47 x 0.28	$1.71	ERM/LRA	-	125 - 300	-	?	-
	Renesas	DA7280-00V42	1.35 x 1.75 x 0.55	$0.73	ERM/LRA	-	50 - 300	5.5	500	-

Power Subsystem

• Battery

  • Considered high risk due to highest priority (P0) designation, size constraints, and significant impact to mechanical design should battery need to be respec’d
  • Improving single charge battery life was among most important requirements for new design
  • Likely needed to pursue custom battery pack design to meet performance and space requirements

• Charger

  • Considered low risk due to confidence in ability to spec IC that meets performance requirements

• Switching Regulators

  • Considered high risk due to potential for switching noise to negatively impact radio subsystem
  • Buck regulator (3V3) needed for system-wide power
    • Spec’d to easily handle full system load current (IOUT ≥ 1A)
    • Variable output was favored to accommodate worst case dropout voltage (VDO)
  • Boost regulator (5VO) provisioned for in case speaker amplifier is not powerful enough with 3V3
    • Could not be known for sure until final enclosure and audio were used for testing

• Linear Regulator

  • Considered low risk due to confidence in ability to spec IC that meets performance requirements

Battery and Charger

Battery No selection made yet, working with the following suppliers to find a pack that fits space constraints:

• Ampere Power, VCELL Power, PHD Energy, LiPol, Nova, Grepow

Charger Selection: MCP73871T-2CCI/ML

Key Criteria: Supports Load Sharing

Justification:

• Stayed with incumbent option and opted out of extensive component surveying for this part in favor of other more critical design elements

Power Regulators

Selection: TPS62824 (Buck), TPS61202DRCT (Boost), NCP187AMT330TAG (LDO)

Key Criteria: Efficiency, Output Current & Voltage, PSRR

Justification:

• Buck & Boost were chosen based on highest efficiency
• LDO was chosen based on combination of relatively low VDO and sufficiently high IOUT

TYPE	MFR	PRODUCT #	DIMENSIONS (mm)	COST (QTY 100)	VIN (V)	VOUT (V)	F_SW (MHz)	EFFICIENCY	IOUT (mA)	VDO (mV)	PSRR (dB)	NOTES
BUCK	TI	TPS62808YKAR	1 x 0.7 x 0.25	$0.62	1.8-5.5	1.8-3.3	1.5	94-97%	600	-	-	Constant f_sw = reduces RF interference but lower efficiency at light loads
	TI	TPS62849DLCR	2 x 1.5 x 1	$0.98	1.8-6.5	3.4	1.8	90-97%	750	-	-
	Microchip	MCP1603T-330I/OS	2.8 x 2.9 x 1	$1.00	2.7 - 5.5	3.3	2	75-95%	500	-	-
	TI	TPS62080DSGR	2 x 2 x 0.7	$1.19	2.3 - 6	Variable	2	85-95%	1200	-	-
	TI	TPS62824DMQR	1.5 x 1.5 x 1	$0.70	2.4 - 5.5	Variable	2.2	93-97%	1000	-	-
	TI	TPS62237DRYT	1 x 1.5 x 0.6	$1.11	2.05 - 6	3.3	2	87-95%	500	-	-	Suitable for linear regulator replacement
BOOST	TI	TPS610997YFFR	1.23 x 0.88 x 0.5	$0.76	0.7 - 5.5	5	Dynamic	90-95%	800	-	-	Dynamic f_sw for high efficiency at low loads
	TI	TPS61240YFFT	1.29 x 0.89 x 0.5	$0.76	2.3 - 5.5	5	3.5	83-93%	450	-	-
	ADI	MAX8969EWL50+T	1.26 x 1.26 x 0.45	$1.30	2.5 - 5.5	5	3	86-95%	700	-	-
	onsemi	FAN48610UC50X	1.25 x 1.25 x 0.4	$0.61	2.5 - 4.8	5	2.5	70-92%	1000	-	-	Very low efficiency at less than 10 mA
	Microchip	MCP1642BT-50I/MC	2 x 3 x 1	$1.00	0.65 - 5.5	5	1	45-95%	800	-	-	"Low noise, Anti-Ringing control"
	TI	TPS61202DRCR	3 x 3 x 0.8	$1.32	0.3 - 5.5	5	1.25 - 1.65	80-93%	800	-	-	Option to turn off power-saving mode and reduce emissions spread
LDO	onsemi	NCP176AMX330TCG	1.25 x 1.25 x 0.5	$0.17	5.5	3.3	-	-	500	165	75 (1 kHz)
	TI	LP5912-3.3DRVR	2 x 2 x 0.8	$0.82	6.5	3.3	-	-	500	180	75 (100 Hz)
	onsemi	NCV8189CMTWADJTAG	2 x 2 x 0.7	$0.51	5.5	3.3	-	-	500	129	85 (1 kHz)
	onsemi	NCP161AMX330TBG	0.67 x 0.67 x 0.26	$0.24	5.5	3.3	-	-	450	260	70? (1kHz)
	Microchip	MIC94345-SYMT-TR	1.6 x 1.6 x 0.5	$0.36	3.6	3.3	-	-	500	200	??
	onsemi	NCP187AMT330TAG	2 x 2 x 0.8	$0.44	5.5	3.3	-	-	1200	220	75

Firmware Design

Firmware Development Approach

Firmware development is initiated by defining the requirements and choosing the appropriate hardware platform. For this project, we have selected the ESP32-PICO-MINI-02. To facilitate the development process and ensure alignment with the user interface design, we document the program flow, state transitions, and critical error handling within a comprehensive set of flow charts.

As the existing prototype already included Wi-Fi functionality, defining the function of the Bluetooth/BLE link profile to be used and rationalizing this against available libraries for the target platform is also a critical task. Selecting and setting up the development environment enables code drafting and testing to begin.

Firmware Flow Charts

Firmware Development

• Bluetooth Profile

  • BLE Audio Profile: Investigated for low energy consumption and solid embedded system support, unable to utilize due to lack of iOS support
  • BT Classic Profiles (A2DP, HFP, HSP): Not fit to application or lacking in royalty-free open-source library support
  • Plan of Record: Utilize BLE GATT to transfer data packets similar to Wi-Fi implementation, essentially generating custom profile
    • Requires coordination with mobile app developer to support custom profile

• Development Environment

  • PlatformIO: Espressif discontinued support for PlatformIO, latest version of ESP-IDF not available (#1225)
    • I2S drivers in older version of IDF caused audio issues when interfacing with other libraries
    • Some success using audio-tools library by Phil Schatzmann
  • Plan of Record: Develop in VSCode using ESP-IDF extension for v5.3 library support

User Experience + Industrial Design

Identifying the most streamlined user interactions and device feedback is crucial to maintaining the integrity of the experience using the O1 Light. This was done through an in-depth exploration of unique user inputs, main device use cases, error states, and various edge cases within the context of larger user flows. Identification of haptic / visual / auditory feedback for each interaction helped to understand the ability for a user to interact with the device using very simple inputs.

In addition, collaboration with electrical and mechanical engineering resulted in various high-level device form constraints and helped to understand color, material, and finish options to be had through various manufacturing techniques.

Industrial Design Approach

User Interface / Workflow

• Identified the main user flow + auxiliary flows for user interaction points
• Determined inputs required to progress interaction
• Reviewed how the device should respond to user inputs, communicate error states, etc.

Main User Flow

Identified Auxiliary User Flows

Charging / Pairing

Volume / Speaker Interrupt

User Inputs + Device Feedback

Power and Prompt Actions

Action / State	User Input	Device Feedback
Power On	Press and hold thumb button for 3 s	Haptics, Auditory Tone, white LED on (then off after tbd time)
Power Off	Press thumb button then press and hold for 3 s	Haptics, Auditory Tone, white LED on then turns off
Woken From Sleep + Begin Prompt Dictation	Press and hold thumb button	Haptics upon successful wake + connection (indicating ready to speak) - would typically be ~1s tbd
End Prompt Dictation	Release thumb button	Haptics
Prompt Response	NA	Auditory language model generated response
Error State	NA	Triple haptics, red LED, tbd audio response (error codes, etc. to be determined)

Charging and Pairing Actions

Action / State	User Input	Device Feedback
Charging Begun	USB C Cable Inserted	Haptics, Auditory Tone, LED on indicating charge level
Charging Finished	NA	LED cycles through red, amber, and green until full
Enter Pairing Mode	Press thumb button 5X	Haptics, auditory tone, LED flashes blue
App Setup Procedures	TBD (need to get app developer inputs)	TBD (need to get app developer inputs)
Device Paired Successfully	NA	Haptics, White LED

Volume and Speaker Actions

Action / State	User Input	Device Feedback
Volume Prompting	Using main interaction flow, user requests volume change verbally	Haptics, Auditory Tone, white LED on (then off after tbd time)
Volume Response / Setting	NA	Haptic response when setting is altered, auditory LLM response to prompt in volume set
Speaker Interrupt + Battery Status	Press and release thumb button	Current prompt response cancelled, LED displays current battery status
*Speaker “mute”	Power Device Off

UX Development - Form Factor / Ergonomics

Manufacturing Recommendations

	Option 1	Option 2A	Option 2B
Case	3D Printed	Injection Molded	Injection Molded
Sleeve	Sleeve is Required	Sleeve is Optional	No Sleeve
Cosmetic Impact	Looks like a finished product but only with a sleeve. 3D printed is sub-par when compared to molded.	Case is highly-cosmetic but sleeve finishes off design	Case is highly-cosmetic
Size Impact	Sleeve adds 1-2 mm in all directions to overall size	Sleeve adds 1-2 mm in all directions to overall size	Smallest Possible Device
Pocket + Handfeel Impact	Sleeve feels great in the hand, however, decreases pocketability and gathers dust.	Sleeve feels great in the hand, however, decreases pocketability and gathers dust.	Use of molded texture provides great handfeel and easily goes in and out of the pocket, free of dust.
Perceived Value	Sleeve adds quality finish over low-quality case.	Sleeve can be optional, which may add value	Lack of sleeve doesn’t decrease value due to part finish/quality
Cost Impact (USA)	Roughlt $16.67 each	Roughlt $15.28 each	Roughlt $8.61 each
Cost Impact (Overseas)	Roughlt $13.52 each	Roughlt $6.17 each	Roughlt $2.65 each
Perceived Future-Forward	Most futuristic but also hidden; more story value	Most futuristic but also hidden; more story value	N/A

Material Finish / Part Examples (Injection-molded)

Appendix

Manufacturing and Build Vendors

Enclosure + Cover

Part	Manufacturing Method	Vendor	Location	Lead Time	Cost Per Unit	Notes
Enclosure	Injection Molding	Xometry	USA	25 business days for T1 samples Production parts would ship 2-3 weeks after T1 approval	$8.61	They think they can shorten the lead time but need final part design first. 5,000 unit tool life
Enclosure	Injection Molding	SunPe	China	18 business days for tooling 6 business days for production	$2.65	30,000 unit tool life
Enclosure	Form4 Print	Cad9	USA	400 units a week	$10.00	Pricing was a ballpark from James - he said could be under $10
Elastomer Cover	Compression Molding	Advanced Prototype	USA	3-4 wks for mold and T0 samples 2-3 wks for production	$6.67	10,000 unit tool life
Elastomer Cover	Compression Molding	SunPe	China	32 working days + 3 days shipping	$3.52	30,000 unit tool life

PCBA + Box Build

Field	1	2	3	4
Vendor Name	TASC	PCA	Out of the Box	Schippers and Crew
HQ Location	Seattle, WA	Bellevue, WA	Renton, WA	Seattle, WA
Website	https://tasc-wa.com/	https://www.pcacorporation.com/	https://www.obmfg.com/	http://schippersandcrew.com/
Contact Name	Maggi		Mike Lopez
What sort of timelines are typical for a new program with your company? Planning through to first samples, production, etc. What can we expect?	Depends on complexity - simple could be 1-2 weeks for proof of concept.		There are a lot of variables in this question. At a high level and with just what’s seen in the attachment, the project of quoting/ordering parts/assembly/testing could all be done in 10-20-Days. If all data and parts (Components, PCB’s & Stencil) are in-house, PCB Assembly timelines are offered at Same-Day through 15-Days or scheduled drops. This is in regard to components applied to a PCB only. Production or starting production drops could be daily through whatever timeline suits your needs. Our facility is wide open for new work.	Timeline for our turkey build, will depend on the availability of the components but we can expedite our production, production lead time ranges from 3 days to 1 week depending on the number of components and complexity of the build. Our normal production lead time for PCBA is 3 weeks. Add -1 to 2 weeks if testing/programming and box build is included. What you can expect from Schippers are our full support to make sure we launch your product successfully. We have an open-door policy for our client and you can come and work with our team during the assembly process.
Do you typically handle fixtures for test or programming internally or expect those to be provided?	Hex files are typically provided for programming. We can perform programming and test. Test fixtures/procedures are something we can help design and manufacture.		We’d prefer you to provide test fixturing or devices with clear instructions of the test procedures/programming. We don’t offer programming for test but we can offer the labor to perform and certify the conformance. Typically we’d suggest our OEM’s go to an engineering firm for building that data package.	Majority of our customers are having their boards tested here at Schippers especially those boards needed conformal coating. All fixtures for test and programming are provided by customers. If simple functional test, we may have our own equipment we can use, we just need to understand what kind of testing you required. What you mentioned dual use fixtures are what we currently see provided to us.
Assuming you’ll do the PCB Assembly, given details on the attachment, what sort of typical timelines do you have if we’re consigning components to you?	How many SMD components? How many TH components? Are there any BGA's? Consignment standard lead time is 4 wks, Turnkey is 6 wks. We can improve on that on an as needed basis. A final BOM would help determine lead time.		You mentioned 100 boards for first runs then 2500 for beta. They look pretty small so 100 of the electronics portion can be completed in less than 5-days for sure. 2500 could be completed in 5/10/15-Days. I don’t quite know what that product has inside it but if there’s more than one PCB or if it’s a flex PCB then lets get more details to talk about.	As mentioned previously, lead time for assembly depends on complexity of the build and number of components. Our consignment lead time ranges from 3 days to 1 week and normal lead time is 2-3 weeks.
For PCBs, do you have a vendor or vendors you prefer to work with?	No preference if you are supplying. If TASC is providing we have our vendors we use.		We absolutely have PCB vendors. We do use multiple options for the quote process and will have pricing back from them in less than 24 hours. We can also pass their info off to you if you’d like to use them directly and consign.	For PCB fab, yes, we do have a vendor that we preferred to work with, we have domestic and overseas vendors depending on application. Their normal lead time ranges from 4-6 weeks and, for expedite depending on how many layers and complexity.
For a full program, can you manage electrical component procurement and have the mechanical components consigned?	YES, if CAD or STP files are available we can also source the enclosure components through Xometry or Fathom or your preferred vendor.		Absolutely no problem at all.	Yes, we can do EE procurement and accept ME consigned parts. We can also procure ME parts as long vendors are established especially for the custom parts.
What sort of receiving or final QA programs do you have in place?	We operate all jobs through the job with QC sign offs at different stages of the assembly. Final QA would be done at the program and test phase from what I am gathering from your description.		Our Engineering produced assembly documentation contains inspection points i.e. Visual Inspection, X-Ray, AOI, Solder validation, etc. Both In-Process and Final. Our in-house FAI and the Assembly Documentation are designed specifically to accommodate all customer PO requirements and needs.	For custom parts that we purchased, it is mandatory to do an in-process inspection, to make sure it is up to spec. For consigned EE/ME parts, it goes thru our kit audit department. Any discrepancy on the counts, mismatch on PN against your BOM will be addressed during kit audit.

Documentation

Espressif FCC ID Change Authorization Letter

Facture

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